发明名称 PRINTED CIRCUIT BOARD WITH EMBEDDED ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a printed circuit board with an embedded electronic component.SOLUTION: A method of manufacturing a printed circuit board with an embedded electronic component includes the steps of: processing a cavity in a core substrate; attaching a support base to one surface of the core substrate in which the cavity is processed; inserting an electronic component 130 into the cavity; affixing the electronic component to a side wall of the cavity by use of a liquid adhesive 140; removing the support base; and stacking an insulation layer 120 and a copper foil layer 150 simultaneously on both surfaces of the core substrate from which the support base is removed.SELECTED DRAWING: Figure 1
申请公布号 JP2016111359(A) 申请公布日期 2016.06.20
申请号 JP20150232268 申请日期 2015.11.27
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 MOON MYEONG-DAE;JUNG BYUNG-SUB
分类号 H05K3/46 主分类号 H05K3/46
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