发明名称 |
PRINTED CIRCUIT BOARD WITH EMBEDDED ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a printed circuit board with an embedded electronic component.SOLUTION: A method of manufacturing a printed circuit board with an embedded electronic component includes the steps of: processing a cavity in a core substrate; attaching a support base to one surface of the core substrate in which the cavity is processed; inserting an electronic component 130 into the cavity; affixing the electronic component to a side wall of the cavity by use of a liquid adhesive 140; removing the support base; and stacking an insulation layer 120 and a copper foil layer 150 simultaneously on both surfaces of the core substrate from which the support base is removed.SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016111359(A) |
申请公布日期 |
2016.06.20 |
申请号 |
JP20150232268 |
申请日期 |
2015.11.27 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
MOON MYEONG-DAE;JUNG BYUNG-SUB |
分类号 |
H05K3/46 |
主分类号 |
H05K3/46 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|