Semiconductor device including a MOSFET and having a super-junction structure

摘要

In a semiconductor power device such as a power MOSFET having a super-junction structure in each of an active cell region and a chip peripheral region, an outer end of a surface region of a second conductivity type coupled to a main junction of the second conductivity type in a surface of a drift region of a first conductivity type and having a concentration lower than that of the main junction is located in a middle region between an outer end of the main junction and an outer end of the super-junction structure in the chip peripheral region.

主权项

1. A semiconductor device including a MOSFET, comprising:
a semiconductor substrate having a first main surface provided with a source electrode and a gate electrode of the MOSFET and a second main surface provided with a drain electrode of the MOSFET, the first main surface and the second main surface being opposite each other; an active cell region in the first main surface including at least a portion of a drift region of the MOSFET, the drift region having a first conductivity type; peripheral side regions outside the active cell region, the active cell region being located between the peripheral side regions; a first super-junction structure provided in the active cell region and extending in a first direction in a plan view; a second super-junction structure provided in each of the peripheral side regions and extending in a second direction, the second direction intersecting with the first direction; a junction region of a second conductivity type provided in a surface of the drift region at an outer end portion of the active cell region, the junction region surrounding the active cell region in the plan view; one or more floating field plates provided over the first main surface of the semiconductor substrate in the peripheral side regions and surrounding the active cell region in the plan view; and a surface resurf region of the second conductivity type provided in the surface of the drift region so as to be coupled to an outer end of the junction region, the surface resurf region surrounding the junction region in the plan view, wherein an outer end of the surface resurf region is between the outer end of the junction region and an outer end of the second super-junction structure in the plan view, and an outer end portion of the source electrode is between the outer end of the junction region and the outer end of the surface resurf region in the plan view.