发明名称 |
High-electron-mobility transistor |
摘要 |
A high-electron-mobility transistor (HEMT) device includes a plurality of semiconductor layers formed on a substrate, wherein a two-dimensional electron gas (2DEG) layer is formed in the semiconductor layers; an etch-stop layer formed on the plurality of semiconductor layers; a p-type semiconductor layer pattern formed on the etch-stop layer; and a gate electrode formed on the p-type semiconductor layer pattern. |
申请公布号 |
US9379227(B2) |
申请公布日期 |
2016.06.28 |
申请号 |
US201614995622 |
申请日期 |
2016.01.14 |
申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
Lee Jae-hoon;Park Chan-ho;Lee Nam-young |
分类号 |
H01L29/66;H01L29/778;H01L29/08;H01L29/417 |
主分类号 |
H01L29/66 |
代理机构 |
Onello & Mello, LLP |
代理人 |
Onello & Mello, LLP |
主权项 |
1. A high-electron-mobility transistor device comprising;
a first semiconductor layer and a second semiconductor layer that are sequentially stacked; an etch-stop layer formed on the second semiconductor layer, the etch-stop layer including silicon carbon nitride (SixC1-xN), where 0<x<1; a third semiconductor layer pattern formed on the etch-stop layer; and a gate electrode formed on at least a portion of the third semiconductor layer pattern, wherein a two-dimensional electron gas (2DEG) region is formed in the first semiconductor layer or the second semiconductor layer. |
地址 |
KR |