发明名称 Photocoupler
摘要 A photocoupler includes: a support substrate; a MOSFET; a light receiving element; a light emitting element; and a bonding layer. The support substrate includes an insulating layer, input and output terminals. The MOSFET is bonded to the support substrate. The MOSFET has a first surface having an operation region. The light receiving element includes p-n junction and is bonded to the MOSFET. The light receiving element has first and second surfaces. The first surface includes a light reception region, a first electrode, and a second electrode. The light emitting element is connected to the input terminal. The light emitting element has first and second surfaces. The first surface includes first and second electrodes. The second surface has a light emitting region. The bonding layer is configured to bond the light emitting element to the light reception region.
申请公布号 US9379095(B2) 申请公布日期 2016.06.28
申请号 US201514755581 申请日期 2015.06.30
申请人 Kabushiki Kaisha Toshiba 发明人 Noguchi Yoshio;Yamamoto Mami;Takai Naoya
分类号 H01L25/16;H01L31/02;H01L31/16;H01L31/14 主分类号 H01L25/16
代理机构 White & Case LLP 代理人 White & Case LLP
主权项 1. A photocoupler, comprising: a substrate including an insulating layer, an input terminal, and an output terminal; a MOSFET provided on the substrate, the MOSFET having a first surface having a first electrode pad and a first bonding region; a light receiving element provided on the first bonding region, the light receiving element having a first surface and a second surface opposite to the first surface, the first surface including a first region, a second region, and a first electrode being located at the second region; a light emitting element electrically connected to the input terminal, the light emitting element having a first surface and a second surface opposite to the first surface, the first surface including a first electrode and a second electrode, the second surface having a light emitting region of emitted light; a bonding layer configured to bond the light emitting element to the first region of the light receiving element; and a first bonding wire coupling the first electrode pad of the MOSFET to the first electrode of the light receiving element, wherein the light emitting element overlaps a portion of the light receiving element, and the MOSFET.
地址 Tokyo JP