| 发明名称 |
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF |
| 摘要 |
A circuit board and a method of manufacturing the same are disclosed. The circuit board includes an insulating part, a thermally conductive structure comprising a first structure and a second structure, and an insulator configured to insulate the first structure from the second structure, wherein the first structure and the second structure are composed of thermally conductive material, and at least a part of the thermally conductive structure is inserted to the insulating part. |
| 申请公布号 |
US2016192471(A1) |
申请公布日期 |
2016.06.30 |
| 申请号 |
US201514981378 |
申请日期 |
2015.12.28 |
| 申请人 |
Samsung Electro-Mechanics Co., Ltd. |
发明人 |
MIN Tae-Hong;KANG Myung-Sam;KO Young-Gwan;SEONG Min-Jae |
| 分类号 |
H05K1/02;H05K3/30;H05K1/18;H05K3/00;H05K1/03;H05K1/11 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A circuit board comprising:
an insulating part; a thermally conductive structure comprising a first structure and a second structure; and an insulator configured to insulate the first structure from the second structure, wherein the first structure and the second structure are composed of thermally conductive material, and at least a part of the thermally conductive structure is inserted to the insulating part. |
| 地址 |
Suwon-Si KR |
