| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device covered by a silicone resin composition.SOLUTION: A method of manufacturing a semiconductor device covered by a silicone resin composition includes the steps of: microfiltrating a silicone resin composition composed of the following components (A) to (E) by a filter having a hole diameter of 0.2 μm or less, (A) a silicone resin RRR(OX)SiO(1) which includes at least two alkenyl groups in one molecule and is a solid at room temperature (B) a silicone resin RRH(OX)SiO(2) which has at least one hydrogen that is bonded to a silicon atom in one molecule and is a solid at room temperature, (C) an addition reaction catalyst, (D) an adhesion imparting agent, and (E) an organic solvent; coating the semiconductor device with the composition; forming a film of the silicone resin by volatilizing the organic solvent by heating; and forming a cured film by curing the silicone resin composition by heating. |
