| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which can form a resin substrate that is low in relative dielectric constant (ε) and dielectric loss tangent (tanδ) values.SOLUTION: A thermosetting resin composition comprises a polymer (A) having a structure represented by formula (A1), and a compound (B) having dihydro-1,3-benzoxazine structure. In the formula (A1), * represents a bond.SELECTED DRAWING: None |
