| 摘要 |
PROBLEM TO BE SOLVED: To provide a defect inspection device capable of detecting poor soldering in the intermediate step of a component mounting process.SOLUTION: Solder area on a pad is determined from the printed circuit board image data obtained by imaging the printed circuit board after a solder printing process, and the component mounting substrate image data obtained by imaging the printed circuit board after a component mounting process. A determination is made as to whether or not poor component mounting has occurred, based on the difference in variation of solder area after the solder printing process and after the component mounting process for each pair of pads. |
