| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat curable adhesive that has low tackiness at ordinary temperature and can strongly adhere by application of low pressure and heat within a short period of time by incorporating a fluidity-imparting resin having a specific softening point and an epoxy resin in the specific proportions, substantially free from any curing agent for the epoxy resin, into a non-tacky polymerization product of a monomer mixture comprising a (meth)acrylate ester and a monoethylenically unsaturated monomer. SOLUTION: A heat curable adhesive is prepared by incorporating 3-30 pts.wt. fluidity-imparting resin having a softening point of 80-200 deg.C and 5-30 pts.wt. epoxy resin into 100 pts.wt. non-tacky polymerization product of a monomer mixture comprising 70-99 wt.% (meth)acrylate ester whose homopolymer has a glass transition temperature of not less than-30 deg.C, represented by the formula, and 30-1 wt.% monoethylenically unsaturated monomer which is copolymerizable therewith and has a functional group reactive with the epoxy resin. In the formula, R1 is H or methyl; R2 is a methylene, ethylene or propylene group; n is an integer of 1-3; andϕis a phenyl group, a monoalkyl-substituted phenyl group or the like.
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