Magnetron sputtering apparatus

摘要

This invention provides a magnetron sputtering apparatus for forming a thin film on a substrate by adhering metal atoms or ions evaporated from a magnetron evaporation source to the substrate, which comprises at least one magnetron evaporation source and at least one auxiliary magnetic pole provided on the circumference of the substrate to generate magnetic lines of force surrounding the substrate. According to this invention, only one kind of magnetron magnetic field structure suffices for the magnetron evaporation sources, a desired sealing magnetic field can be formed regardless of the number or arrangement of the magnetron evaporating sources, and the form of the sealing magnetic field can be easily changed.