METHOD OF DEPOSITING LOW STRESS FILMS

摘要

A method of forming solder bumps (314) on a semiconductor wafer utilizing a low temperature biasable electrostatic chuck. In particular, the method comprises the steps of providing at least one bond pad (304) on the semiconductor wafer, forming a barrier layer (312) over the bond pad, and forming the solder bumps (314) upon the at least one bond pad. By controlling the temperature and biasing of the electrostatic chuck, the barrier layer, such as nickel vanadium, exhibits a low tensile or compressive stress.