WIRE BONDER AND HEIGHT MEASUREMENT METHOD OF WIRE-LOOP USING THE SAME

摘要

A wire bonder and a method for measuring a height of a wire loop using the same are measure the height of the wire loop quickly and accurately by measuring the height while moving a focus lens. A lead and a semiconductor chip are arranged on a stage(230). A capillary(110) is arranged on the stage and wire-loops the lead with the semiconductor chip using plural wires. An imaging unit(240) is arranged on the stage and vertically moved on an upper surface of the semiconductor chip. The imaging unit takes plural images of the wire loop. A first controller(251) electrically transmits the images from the imaging unit. A second controller(252) calculates focal values of the wire loop from the images and compares a minimum focal value with a maximum focal value to calculate a height of the wire loop.