发明名称 |
LIGHT-EMITTING COMPONENT PACKAGE, LIGHT-EMITTING COMPONENT PACKAGING APPARATUS, AND LIGHT SOURCE |
摘要 |
A light-emitting component package includes a light-emitting component (1511), a heat-conductor (1513), a set of electric-conducting leads (1512), and a heat dissipation base (1052). The light-emitting component (1511) is disposed on the heat-conductor (1513) and electrically coupled to the set of electric-conducting leads (1512). The heat-conductor (1513) is insulated from the set of electric-conducting leads (1512) and inserted in a hole (1523) of the heat dissipation base (1052). Meanwhile, the set of electric-conducting leads (1512) is located between at least two heat-conducting portions of the heat-conductor (1513) to form the package with heat outside and electricity inside. A light-emitting component packaging apparatus including a leadframe and a molding base, and a light source device are provided. |
申请公布号 |
WO2008043264(A1) |
申请公布日期 |
2008.04.17 |
申请号 |
WO2007CN02840 |
申请日期 |
2007.09.28 |
申请人 |
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE;LIN, MING-TE |
发明人 |
LIN, MING-TE |
分类号 |
H01F38/14;H01L23/12;H01L23/495;H01L25/00;H01L33/62;H01L33/64 |
主分类号 |
H01F38/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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