发明名称 LIGHT-EMITTING COMPONENT PACKAGE, LIGHT-EMITTING COMPONENT PACKAGING APPARATUS, AND LIGHT SOURCE
摘要 A light-emitting component package includes a light-emitting component (1511), a heat-conductor (1513), a set of electric-conducting leads (1512), and a heat dissipation base (1052). The light-emitting component (1511) is disposed on the heat-conductor (1513) and electrically coupled to the set of electric-conducting leads (1512). The heat-conductor (1513) is insulated from the set of electric-conducting leads (1512) and inserted in a hole (1523) of the heat dissipation base (1052). Meanwhile, the set of electric-conducting leads (1512) is located between at least two heat-conducting portions of the heat-conductor (1513) to form the package with heat outside and electricity inside. A light-emitting component packaging apparatus including a leadframe and a molding base, and a light source device are provided.
申请公布号 WO2008043264(A1) 申请公布日期 2008.04.17
申请号 WO2007CN02840 申请日期 2007.09.28
申请人 INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE;LIN, MING-TE 发明人 LIN, MING-TE
分类号 H01F38/14;H01L23/12;H01L23/495;H01L25/00;H01L33/62;H01L33/64 主分类号 H01F38/14
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