发明名称 NON-CONTACT IC MODULE MOUNTING BOOKLET
摘要 <P>PROBLEM TO BE SOLVED: To provide a non-contact IC module mounting booklet with high physical reliability and long communication distance with a non-contact IC card reader writer at a low manufacturing cost. <P>SOLUTION: In the present invention, only a booster antenna is incorporated in either one of a front cover sheet and a rear cover sheet of the booklet and a corner cut portion or the like is formed in either one of the right and left lower end portions of a body of the booklet. Further in the present invention, the non-contact IC module constituted by mounting a non-contact IC chip on a print coil antenna and thereafter sealing the same with a resin is adhered to one of the front and rear cover sheets of the booklet and a position not overlapping with the corner cut portion of the body of the booklet. The above problem is intended to be solved by the booklet with the constitution in the present invention. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008162120(A) 申请公布日期 2008.07.17
申请号 JP20060354035 申请日期 2006.12.28
申请人 DAINIPPON PRINTING CO LTD 发明人 ARAKI NOBORU;ONO TETSUO
分类号 B42D11/00;B42D15/10;G06K19/07;G06K19/077 主分类号 B42D11/00
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