发明名称 |
Electronic Component Mounted Body, Electronic Component with Solder Bump, Solder Resin Mixed Material, Electronic Component Mounting Method and Electronic Component Manufacturing Method |
摘要 |
In an electronic component mounted body, an electrode of a first electronic component and an electrode of a second electronic component are electrically connected by a solder connecter, and the solder connecter contains solder and insulation filler. Alternatively, a solder bump is formed on the electrode of the electronic component, and the solder bump includes the insulation filler. |
申请公布号 |
US2009008776(A1) |
申请公布日期 |
2009.01.08 |
申请号 |
US20070281195 |
申请日期 |
2007.02.23 |
申请人 |
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发明人 |
KITAE TAKASHI;NAKATANI SEIICHI;KARASHIMA SEIJI;SAWADA SUSUMU;HOTEHAMA KENICHI |
分类号 |
H01L23/488;H01L21/56;H05K1/02;H05K3/30 |
主分类号 |
H01L23/488 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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