SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

摘要

A semiconductor structure and a forming method thereof are provided. The semiconductor structure comprises: a substrate including a plurality of conductive traces; and a semiconductor chip. The semiconductor chip comprises: a surface which faces the plurality of conductive traces; and a plurality of conductive pads which are on the surface and are correspondingly electrically connected to the plurality of conductive traces through a plurality of conductive bumps. A height of each of the plurality of conductive bumps is determined by a minimum distance between the plurality of conductive pads and the corresponding conductive traces thereof.