发明名称 |
LED PACKAGE HAVING A MICRO LIGHT SOURCE AND ITS MANUFACTURING METHOD |
摘要 |
According to the present invention, disclosed are a light emitting diode (LED) package having a small light source and a manufacturing method thereof, capable of enhancing light efficiency by reducing the total reflection of light emitted from a light emitting device. According to the present invention, the LED package comprises: the light emitting device formed in a lead frame; a partition unit formed in the lead frame apart from the light emitting device to surround the light emitting device while transmitting the light emitted from the light emitting device; a transparent lens accommodating the light emitting device and the partition unit in the inside to reduce the total reflection of the light emitted from the light emitting device; and a reflector installed in the lead frame to reflect the light emitted from the light emitting device. A filling material including a fluorescent substance is prepared in a partitioned space part formed by the partition unit and the transparent lens is installed in the reflector. |
申请公布号 |
KR20160067533(A) |
申请公布日期 |
2016.06.14 |
申请号 |
KR20140173056 |
申请日期 |
2014.12.04 |
申请人 |
ENTEC L&E CO., LTD. |
发明人 |
KIM, YOUNG WUG;PARK, JE MYUNG;LEE, JUNG JU;NAM, HEE DONG |
分类号 |
H01L33/48 |
主分类号 |
H01L33/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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