| 摘要 |
An electronic device component comprising: a support frame 80 comprising a top surface, a bottom surface, and an opening extending between the top surface and bottom surface of the support frame 80; a diamond heat spreader 82,84 comprising a wafer of synthetic diamond material having a top face, a bottom face, where the diamond heat spreader 82,84 is bonded to the support frame 80 so that the diamond heat spreader 82,84 extends across the opening in the support frame 80; and one or more semiconductor components 86,88 mounted on, and bonded to, the top face of the diamond heat spreader 82,84 and on the top face of the support frame 80; where the support frame 80 is formed of an electrically insulating ceramic material to which the diamond heat spreader 82,84 is bonded; where one or more electrical connections 92, formed of a patterned metallization layer, are mounted on the top surface of both the support frame 80 and the diamond heat spreader 82,84 and configured to electrically connect to the one or more semiconductor components 86,88, where the top face of the diamond heat spreader is co-planar with the top surface of the support frame to within 500µm. Also disclosed is the heat spreading substrate for the above electronic device component. Further disclosed is a method of fabricating a heat spreading substrate, the method comprising: mounting a diamond heat spreader in a green ceramic body; firing the green ceramic body whereby the ceramic body shrinks and hardened around the diamond heat spreader thus directly bonding the diamond heat spreader to the ceramic body which forms a ceramic support frame around the diamond heat spreader; and metalizing a top surface of the diamond heat spreader and the ceramic support frame. |
