发明名称 CAMERA MODULE AND MANUFACTURING METHOD THEREOF
摘要 PURPOSE: A camera module and a manufacturing method are provided to attach a second printing circuit board of a RPCB(Rigid Printed Circuit Board) in edge of a first printing circuit board and accepts an image sensor in a hole area of the second printing circuit board. CONSTITUTION: An optical image of the subject incidents a plurality of lenses(10). A first PCB(Printed Circuit Board) of a first thickness is arranged in lower part of the lens unit. The first PCD has a window for passing through the light image. A second PCB(50) of a second thickness has a hole area(51) for accepting the first PCB. The girth of the first PCB is attached at upper side of inside hole area. An image sensor(60) is accepted in hole area.
申请公布号 KR20110005103(A) 申请公布日期 2011.01.17
申请号 KR20090062632 申请日期 2009.07.09
申请人 LG INNOTEK CO., LTD. 发明人 KIM, EUN MI
分类号 H04N5/225 主分类号 H04N5/225
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