| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing a microchannel chip having an electrode, capable of suppressing deformation of the channel generated upon thermal compression bond.SOLUTION: In a production method of a microchannel chip obtained by bonding a first substrate 110 made of a resin having a flow passage part 116 on one surface 112 side onto a second substrate 120, an elastic body sheet 220 and/or a metal sheet 210 are placed on the surface of a heater 300, and the flow passage part 116 is subjected to thermal compression bond by the heater 300, to thereby bond the first substrate 110 onto the second substrate 120.SELECTED DRAWING: Figure 1 |
