| 摘要 |
PROBLEM TO BE SOLVED: To provide a film for semiconductor, which can manufacture a highly reliable semiconductor device while promoting improvement of its picking-up property and avoiding generation of a fault in a semiconductor element; and to provide a method of manufacturing the semiconductor device using the same.SOLUTION: The film for semiconductor 10 supports a semiconductor wafer 7 when the semiconductor wafer 7 is laminated on an upper surface of an adhesion layer 3 to dice the semiconductor wafer 7. When the semiconductor wafer 7 which is cut into pieces (a semiconductor element 71) is picked up, a first viscous layer 1 is selectively peeled from the adhesion layer 3. When the adhesion force of the semiconductor element 71 obtained by laminating the film for semiconductor 10 on the semiconductor wafer 7 and cutting the semiconductor wafer 7 into pieces by dicing is measured, and the adhesion force of an edge of the semiconductor element 71 is a(N/cm) and the adhesion force of a center (a part other than edges) of the semiconductor element 71 is b(N/cm), a/b is at least 1 and not more than 4. |
