| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical communication module which is miniaturized. SOLUTION: The optical communication module 1 includes a substrate piece 11 having a through hole 12 through which an optical fiber is inserted between a first face 21 and a second face 22; a translucent resin film 16 so arranged on the first face 21 of the substrate piece 11 to cover the through hole 12; a wiring film 17 arranged on at least a face of the translucent resin film 16; an optical element 13 connected to the wiring film 17 and installed on the through hole 12 via the translucent resin film 16; a sealing member 15 which seals the substrate piece 11 including the translucent resin film 16, the wiring film 17 and an optical element 13 over the first face 21 side and the second face 22 side, and open the entrance of the through hole 12 of the second face 22 side. COPYRIGHT: (C)2005,JPO&NCIPI |
