STACKED ELECTRONIC COMPONENT, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING STACKED ELECTRONIC COMPONENT

摘要

In a status where a stacked electronic component having a resin layer on a mounting substrate side is mounted on the mounting substrate, even when deformations such as warping and strain are generated in the mounting substrate, stress due to such deformations to the staked electronic component can be modified. In the stacked electronic component (1), end sections (12, 13) of columnar conductors (8, 9) are protruded from a main plane (14) facing external of a resin layer (6). When the stacked electronic component (1) is mounted on the mounting substrate (2) and the end portions (12, 13) of the columnar conductors (8, 9) are electrically connected with a conductive land (26) on the mounting substrate (2), a prescribed interval (31) is formed between the stacked electronic component (1) and the mounting substrate (2).