POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERN AND ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for electronic materials causing no corrosion reaction to copper and copper alloys of metal wiring, etc., and having good film adhesion and sensitivity, a method for producing a pattern and electronic components.

SOLUTION: The positive photosensitive resin composition comprises (A) a polybenzoxazole precursor having a structure represented by formula (I) (wherein X is a divalent organic group; Y is a tetravalent organic group; R1is H or a monovalent organic group; and m is an integer of 2-500 and represents the number of repeating units of the polymer), (B) a solvent, (C) a tetrazole derivative and (D) a compound which generates an acid by light.

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