发明名称 METHOD OF FORMING METAL DEPOSITION FILM
摘要 PROBLEM TO BE SOLVED: To provide a method of forming a metal deposition film that can inhibit a resin substrate from absorbing a heat ray, inhibit deformation and dimensional variation in the resin substrate due to a rise in temperature and is excellent in productivity in vacuum deposition and the like.SOLUTION: A method of forming a metal deposition film on the resin substrate 1 includes: a first step of forming a metal deposition film with a vapor deposition heat amount of 50 to 500 J/m; and a second step of forming a metal deposition film by increasing a vapor deposition heat amount when a heat ray reflection rate of the metal deposition film becomes 50% or more, where a metal deposition source that has a heat capacity smaller than that of a metal deposition source 13 for the second step is used for a metal deposition source 11 for the first step.SELECTED DRAWING: Figure 1
申请公布号 JP2016121374(A) 申请公布日期 2016.07.07
申请号 JP20140261036 申请日期 2014.12.24
申请人 KONICA MINOLTA INC 发明人 MANDA YASUHARU;TAKAHASHI NOBUAKI
分类号 C23C14/24;H05B33/02;H05B33/10;H05B33/26 主分类号 C23C14/24
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