Hole plug for thin laminate

摘要

A method for forming a hole plug in a laminate structure is provided. A laminate structure, is formed, including at least a dielectric layer and a first conductive foil on a first side of the dielectric layer. An unpierced or blind hole is formed in the laminate structure extending toward the first conductive foil from a second side of the dielectric layer and at least partially through the dielectric layer, the hole having a hole depth to hole diameter aspect ratio of less than twenty (20) to one (1). In yet another example, the hole aspect ratio may be less than one (1) to one (1). Via fill ink may then be deposited in the hole. The via fill ink is then dried and/or cured to form a hole plug.

主权项

1. A method for forming a hole plug, comprising:
forming a laminate structure including at least a dielectric layer and a first conductive foil on a first side of the dielectric layer; forming an unpierced or blind hole in the laminate structure extending toward the first conductive foil from a second side of the dielectric layer and at least partially through the dielectric layer, the hole having a hole depth to hole diameter aspect ratio of less than twenty (20) to one (1); depositing via fill ink in the hole; and drying and/or curing the via fill ink to form a hole plug.