Method for forming cell contact

摘要

A method for forming a cell contact. A substrate having first and second protruding structures is prepared. An etch stop layer is deposited over the substrate. A sacrificial layer is deposited on the etch stop layer. The sacrificial layer is recessed. Spacers are formed on the top surface of the sacrificial layer. A portion of the sacrificial layer not covered by the spacers is etched away, thereby forming a recess. A gap filling material layer is deposited into the recess. An upper portion of the gap filling material layer and the spacers are removed to expose the top surface of the sacrificial layer. The sacrificial layer is removed to form contact holes. A punch etching process is performed to remove the etch stop layer from bottoms of the contact holes. The contact holes is filled up with a conductive material layer.

主权项

1. A method for forming a cell contact, comprising:
providing a substrate having a first and a second protruding structures disposed on a major surface of the substrate, wherein the major surface comprises a first cell contact region in close proximity to the first protruding structure and a second cell contact region in close proximity to the second protruding structure; depositing a conformal etch stop layer over the substrate, wherein the etch stop layer conformally covers the first and second protruding structures and the first and second cell contact regions; depositing a sacrificial layer in a blanket manner on the etch stop layer, wherein the sacrificial layer fills up a gap between the first and second protruding structures; recessing the sacrificial layer such that top portions of the first and second protruding structures protrude from a top surface of the sacrificial layer; forming spacers on the top surface of the sacrificial layer and on sidewalls of the protrudent top portions of the first and second protruding structures; using the spacers as an etching hard mask, etching away a portion of the sacrificial layer not covered by the spacers in a self-aligned manner, thereby forming a recess; depositing a gap filling material layer into the recess; performing a first planarization process to remove an upper portion of the gap filling material layer and the spacers, and the protrudent top portions of the first and second protruding structures until the top surface of the sacrificial layer is exposed; removing the sacrificial layer so as to form contact holes in place; performing a punch etching process to remove the etch stop layer from bottoms of the contact holes, thereby exposing the first and second cell contact regions; and filling the contact holes with a conductive material layer.