| 摘要 |
A laminate body, a temporary adhesive composition and a temporary adhesion film are provided which can make warpage less prone to occur even when a wafer is thin. This laminate body comprises, in order and adjacent to each other, a first substrate, a temporary adhesion film and a second substrate. At 25°C, the temporary adhesion film has a modulus of elasticity in tension E of 25-2000 MPa, in accordance with JIS K 7161:1994. One substrate of the laminate body, either the first substrate or the second substrate, is fixed at the temperature of 25°C. The end portion of the other substrate can be separated by lifting said end portion of the other substrate away from the interface with the temporary adhesion film at a speed of 50 mm/m in the direction perpendicular to the surface of said other substrate, and the force applied during said lifting is less than or equal to 0.33 N/mm when measured with a force gauge. |
