发明名称 SEMICONDUCTOR SUBSTRATE ARRANGEMENT AND METHOD FOR FORMING SEMICONDUCTOR SUBSTRATE ARRANGEMENT
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor substrate arrangement and a method for forming the semiconductor substrate arrangement.SOLUTION: A semiconductor substrate arrangement 100 includes: a carrier wafer 110; and a plurality of semiconductor substrate pieces 120 which are fixed to the carrier wafer and distributed on the carrier wafer in a horizontal direction. Each of the plurality of semiconductor substrate pieces has a hexagonal shape.SELECTED DRAWING: Figure 1
申请公布号 JP2016192544(A) 申请公布日期 2016.11.10
申请号 JP20160033657 申请日期 2016.02.24
申请人 INFINEON TECHNOLOGIES AG 发明人 PETER IRSIGLER;JENS PETER KONRATH;HANS-JOACHIM SCHULZE
分类号 H01L21/20;H01L21/02;H01L21/205 主分类号 H01L21/20
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