发明名称 |
SEMICONDUCTOR SUBSTRATE ARRANGEMENT AND METHOD FOR FORMING SEMICONDUCTOR SUBSTRATE ARRANGEMENT |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor substrate arrangement and a method for forming the semiconductor substrate arrangement.SOLUTION: A semiconductor substrate arrangement 100 includes: a carrier wafer 110; and a plurality of semiconductor substrate pieces 120 which are fixed to the carrier wafer and distributed on the carrier wafer in a horizontal direction. Each of the plurality of semiconductor substrate pieces has a hexagonal shape.SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016192544(A) |
申请公布日期 |
2016.11.10 |
申请号 |
JP20160033657 |
申请日期 |
2016.02.24 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
PETER IRSIGLER;JENS PETER KONRATH;HANS-JOACHIM SCHULZE |
分类号 |
H01L21/20;H01L21/02;H01L21/205 |
主分类号 |
H01L21/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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