| 摘要 |
A laser device 1 in which a laser module 2 is installed on a heatsink 3, wherein a base plate 20 of the laser module 2 is fixedly mounted on an installing surface 3s of the heatsink 3 by screwing an outer peripheral portion 20b thereof to the heatsink 3. The laser device 1 is characterized in that, as a result of the resilience of the base plate 20, a central portion 20a of the base plate 20 surrounded by the outer peripheral portion 20b is subjected to a stress in the direction of the installing surface 3s. |
