IC TAG ATTACHING METHOD FOR PACKAGED PRODUCT

摘要

PROBLEM TO BE SOLVED: To provide an IC tag attaching method for a packaged product which prevents the distribution of an imitation, such as an illegally manufactured product stored fraudulently in a package for sale. SOLUTION: A product 10 is stored in a recession 2a formed on a transparent resin sheet 2 and a periphery of the sheet is joined to a paste board 3 to form a blister pack A. An IC tag 1 is so attached to the blister pack A that an antenna of the IC tag 1 or a connection line connected to an IC chip of the IC tag 1 is located at a joint between the transparent resin sheet 2 and the paste board 3. When the transparent resin sheet 2 is peeled off the paste board 3 to take out the product 10, the antenna or connection line is broken to stop the function of the IC tag 1. This allows the detection of an illegal product that cannot be determined to be illegal with its appearance, through access from a reader/writer to the IC tag 1. COPYRIGHT: (C)2007,JPO&INPIT