ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME

摘要

This patent document provides an electronic device including a semiconductor memory that can simplify a fabrication process and improve characteristics of a variable resistance element, and a method for fabricating the same. In one aspect, an electronic device including a semiconductor memory is provided, wherein the semiconductor memory includes: a substrate; a variable resistance element formed over the substrate and exhibiting different resistance states to store data; an interlayer insulating layer formed over the substrate to surround at least a portion of the variable resistance element; an upper electrode contact formed over the variable resistance element to penetrate a portion of the interlayer insulating layer and be in contact with the variable resistance element; and a metal wiring formed over the interlayer insulating layer, and configured to include a stacked structure of a tungsten layer and a barrier layer, wherein the barrier layer is in contact with the upper electrode contact and includes tungsten, boron and iridium.

主权项

1. An electronic device comprising a semiconductor memory, the semiconductor memory comprising:
a substrate; a variable resistance element formed over the substrate and exhibiting different resistance states to store data; an interlayer insulating layer formed over the substrate to surround at least a portion of the variable resistance element; an upper electrode contact formed over the variable resistance element to penetrate a portion of the interlayer insulating layer and be in contact with the variable resistance element; and a metal wiring formed over the interlayer insulating layer, and comprising a stacked structure of a tungsten layer and a barrier layer, wherein the barrier layer is in contact with the upper electrode contact and comprises tungsten, boron and iridium.