发明名称 |
Thermal ground plane for cooling a computer |
摘要 |
A method for cooling a computer uses thermal coupling for conveying heat from powered components of an electronic system. A fluid heat-exchanger is attached to the surface of the electronic system and filled with fluid coolant. A vacuum is applied between the heat-exchanger and the surface to seal the heat-exchanger to the electronic system. The fluid coolant is circulated through the heat-exchanger to convey heat from the fluid to an external cooling apparatus. |
申请公布号 |
US9377251(B2) |
申请公布日期 |
2016.06.28 |
申请号 |
US201414301623 |
申请日期 |
2014.06.11 |
申请人 |
GLOBALFOUNDRIES INC. |
发明人 |
Martin Yves;Van Kessel Theodore G |
分类号 |
F28F3/12;F28D21/00;H01L23/427 |
主分类号 |
F28F3/12 |
代理机构 |
Hoffman Warnick LLC |
代理人 |
LeStrange Michael;Hoffman Warnick LLC |
主权项 |
1. A method for cooling an electronic system, said method comprising:
removably coupling a fluid heat-exchanger to a surface of the electronic system, thus generating an enclosure bounded by said fluid heat-exchanger and said surface, wherein the coupling of the fluid heat-exchanger includes coupling a flexible and conformal sleeve to the surface of the electronic system, the sleeve including:
at least one flexible surface,at least one port for fluid inlet, andat least one port for fluid outlet; filling the fluid heat-exchanger with a liquid coolant; applying a vacuum to the enclosure, removably sealing the fluid heat-exchanger to the surface; and circulating the fluid coolant through the fluid heat-exchanger, conveying heat from said fluid coolant away from the electronic system. |
地址 |
Grand Cayman KY |