发明名称 Thermal ground plane for cooling a computer
摘要 A method for cooling a computer uses thermal coupling for conveying heat from powered components of an electronic system. A fluid heat-exchanger is attached to the surface of the electronic system and filled with fluid coolant. A vacuum is applied between the heat-exchanger and the surface to seal the heat-exchanger to the electronic system. The fluid coolant is circulated through the heat-exchanger to convey heat from the fluid to an external cooling apparatus.
申请公布号 US9377251(B2) 申请公布日期 2016.06.28
申请号 US201414301623 申请日期 2014.06.11
申请人 GLOBALFOUNDRIES INC. 发明人 Martin Yves;Van Kessel Theodore G
分类号 F28F3/12;F28D21/00;H01L23/427 主分类号 F28F3/12
代理机构 Hoffman Warnick LLC 代理人 LeStrange Michael;Hoffman Warnick LLC
主权项 1. A method for cooling an electronic system, said method comprising: removably coupling a fluid heat-exchanger to a surface of the electronic system, thus generating an enclosure bounded by said fluid heat-exchanger and said surface, wherein the coupling of the fluid heat-exchanger includes coupling a flexible and conformal sleeve to the surface of the electronic system, the sleeve including: at least one flexible surface,at least one port for fluid inlet, andat least one port for fluid outlet; filling the fluid heat-exchanger with a liquid coolant; applying a vacuum to the enclosure, removably sealing the fluid heat-exchanger to the surface; and circulating the fluid coolant through the fluid heat-exchanger, conveying heat from said fluid coolant away from the electronic system.
地址 Grand Cayman KY