| 主权项 |
1. A method for manufacturing a MEMS device, the method comprising:
providing a Silicon on Insulator (SOI) wafer, wherein the SOI wafer includes a device layer, an insulating layer and a handle layer; etching the device layer to form a recess and at least one annular protrusion surrounding the recess; forming at least one first trench in the annular protrusion and forming, in the device layer, a second trench on the recess, wherein the at least one first trench and the second trench extend to the insulating layer; bonding the annular protrusion with a substrate including a plurality of metal bonding areas disposed on an upper surface of the substrate; thinning the handle layer; forming a plurality of first holes in a portion of the handle layer corresponding to the at least one first trench and forming at least one second hole in a portion of the handle layer corresponding to a middle area of the recess, wherein the plurality of first holes and the at least one second hole extend through the insulating layer to the device layer; filling the plurality of first holes and the at least one second hole with conductive material to create a plurality of first conductive pillar and at least one second conductive pillar; forming, on the recess, at least one first moving part, at least one second moving part, a plurality of first springs connected to the first moving part and the second moving part, and a plurality of second springs by etching the device layer, the insulating layer and the handle layer corresponding to the recess, wherein the insulating layer is disposed between a first conductive portion of the at least one first moving part and a second conductive portion of the at least one first moving part, wherein the insulating layer is disposed between a first conductive portion of the at least one second moving part and a second conductive portion of the at least one second moving part, wherein the insulating layer is disposed between a first conductive portion of at least one first spring of the plurality of first springs and a second conductive portion of the at least one first spring, and wherein the insulating layer is disposed between a first conductive portion of at least one second spring of the plurality of second springs and a second conductive portion of the at least one second spring; and forming at least one anchor at the annular protrusion by etching the device layer, the insulating layer and the handle layer, wherein the plurality of second springs connects to the second moving part and the at least one anchor, and wherein the insulating layer is disposed between a first conductive portion of the at least one anchor and a second conductive portion of the at least one anchor, wherein the first conductive portion of the at least one first spring is connected to the first conductive portion of the at least one first moving part and the first conductive portion of the at least one second moving part, and the first conductive portion of the at least one second spring is connected to the first conductive portion of the at least one second moving part and to the first conductive portion of the at least one anchor; wherein the at least one first moving part comprises the at least one second conductive pillar connected to the first conductive portion of the at least one first moving part and to the second conductive portion of the at least one first moving part; wherein the at least one anchor comprises at least one first trench and the at least one first conductive pillar, the second conductive portion of the at least one anchor is divided into an outer conductive portion and an inner conductive portion by the at least one first trench, the at least one first conductive pillar is connected to the outer conductive portion and the first conductive portion of the at least one anchor, and the outer conductive portion and the inner conductive portion of the at least one anchor are respectively fixed on the plurality of metal bonding areas that are spaced apart; wherein the at least one second moving part has a second trench, the second conductive portion of the at least one second moving part is divided into an outer conductive portion and an inner conductive portion by the second trench; wherein the second conductive portion of the at least one first spring is connected to the second conductive portion of the at least one first moving part and to the inner conductive portion of the at least one second moving part; and wherein the second conductive portion of the at least one second spring is connected to the outer conductive portion of the at least one second moving part and the inner conductive portion of the at least one anchor. |
