Electronic component package

摘要

An electronic component package includes a substrate having at least one electronic circuit; a sealing resin for sealing the electronic circuit, at least one filler on which at least one crack is formed being filled in the sealing; and a metal film formed on a top surface of the sealing resin, a root of the metal film being embedded in the crack on the filler. The electronic component package can shield the environmental electromagnetic noise and satisfy with lightweight requirement for the integrated circuit modules.

主权项

1. An electronic component package, comprising:
a substrate having at least one electronic circuit; a sealing resin for sealing the electronic circuit, at least one filler being filled in the sealing resin; at least one crack formed in the at least one filler by hitting or striking the filler; and a metal film formed on a top surface of the sealing resin, a root of the metal film being embedded in the crack of the filler.