| 发明名称 |
Contact component and semiconductor module |
| 摘要 |
A contact component adapted to be soldered onto a metal region provided on an insulating substrate of a semiconductor module includes a cylindrical portion; a hollow hole for fitting an external terminal; and a flange formed at a lower end portion of the cylindrical portion and having a diameter larger than an external diameter of the cylindrical portion. An end face of the flange adapted to be soldered includes a flat bottom surface and a concave portion extending from an inner circumference edge of the cylindrical portion in the flat bottom surface to an outer circumference edge of the flange. The cylindrical portion includes a cut-out portion at an inner side of a lower end thereof. |
| 申请公布号 |
US9406633(B2) |
申请公布日期 |
2016.08.02 |
| 申请号 |
US201514817894 |
申请日期 |
2015.08.04 |
| 申请人 |
FUJI ELECTRIC CO., LTD. |
发明人 |
Isozaki Makoto |
| 分类号 |
H01L23/52;H01L23/00;H01L23/498;H05K3/34 |
主分类号 |
H01L23/52 |
| 代理机构 |
|
代理人 |
Kanesaka Manabu |
| 主权项 |
1. A contact component adapted to be soldered onto a metal region provided on an insulating substrate of a semiconductor module, the contact component comprising:
a cylindrical portion having a hollow hole for fitting an external terminal; and a flange formed at a lower end portion of the cylindrical portion, and having an external diameter larger than an external diameter of the cylindrical portion, wherein an end face of the flange adapted to be soldered includes a flat bottom surface and a concave portion extending from an inner circumference edge of the cylindrical portion in the flat bottom surface to an outer circumference edge of the flange, wherein the cylindrical portion includes a cut-out portion at an inner side of a lower end thereof. |
| 地址 |
Kawasaki-Shi JP |
