| 发明名称 | Semiconductor module and power converter | ||
| 摘要 | A semiconductor module includes a case, a semiconductor component provided in the case for switching a current, encapsulating resin provided in the case for covering the semiconductor component, a magnetic shield contacting the encapsulating resin and containing a magnetic material, and an embedded magnetic shield embedded in the case, the embedded magnetic shield containing a magnetic material. | ||
| 申请公布号 | US9406624(B2) | 申请公布日期 | 2016.08.02 |
| 申请号 | US201514825922 | 申请日期 | 2015.08.13 |
| 申请人 | MITSUBISHI ELECTRIC CORPORATION | 发明人 | Yoneyama Rei;Goto Akira |
| 分类号 | H01L23/552;H01L23/31 | 主分类号 | H01L23/552 |
| 代理机构 | Studebaker & Brackett PC | 代理人 | Studebaker & Brackett PC |
| 主权项 | 1. A semiconductor module comprising: a case; a semiconductor component provided in the case for switching a current; encapsulating resin provided in the case for covering the semiconductor component; a magnetic shield contacting the encapsulating resin and containing a magnetic material; and an embedded magnetic shield embedded in the case so as to be surrounded by the case on all sides, the embedded magnetic shield containing a magnetic material. | ||
| 地址 | Tokyo JP | ||