MEMS microphone module and manufacturing process thereof

摘要

A micro-electro-mechanical system (MEMS) microphone module and a manufacturing process thereof are described. A thickness of a transparent temporary cover plate temporarily disposed in a conventional plastic package structure is adjusted. After a mold for a plastic protector is formed, an UV ray is utilized to irradiate the mold to reduce adherence on the temporary cover plate and a back surface of the MEMS acoustic wave sensing chip. Then, the temporary cover plate is removed, and the left space left is the main source for the back-volume of the MEMS microphone. Finally, a tag is covered on the plastic protector, so as to define the whole back-volume and form a closed back-volume. In the above-mentioned process, the size of the back-volume is the same as an area of the whole MEMS microphone chip. In addition, the back-volume can be defined.

主权项

1. A micro-electro-mechanical system (MEMS) microphone module, comprising:
a supporting substrate, having a plurality of pads and an acoustic wave injection hole; an MEMS microphone chip, having a chip upper surface and a chip lower surface, wherein the chip upper surface is directly flip-chip bonded to the pads and has an acoustic wave sensing mechanism region, and the chip lower surface relative to the other side of the acoustic wave sensing mechanism region has a recess, so as to form an acoustic wave sensing unit; a plastic body, enclosing all elements on the supporting substrate except for the chip lower surface of the MEMS microphone chip, and forming an external structural main body of the MEMS microphone module, wherein the pads are sandwiched between the supporting substrate and the plastic body, and opposite two inner side surfaces of the plastic body contact the MEMS microphone chip; and a tag, adhered to an outer surface of the plastic body, so as to define a back volume; wherein the supporting substrate, the plastic body and the tag are three discrete parts.