SEMICONDUCTOR PROCESSING TAPE

摘要

[Problem] To provide a semiconductor processing tape which has a low thermal shrinkage rate and is not subject to wrinkles because the tape shrinks uniformly regardless of tape direction, and in which kerf width extends uniformly without displacement of chip position. [Solution] Provided is a semiconductor processing tape that is characterized in that the thermal shrinkage rate in both the length direction and width direction of the tape when heated for 10 seconds at 100 °C is 0-20%, inclusive, and when the thermal shrinkage rate in either the length direction or the width direction is 0.1% or more, the thermal shrinkage rate in the length direction/the thermal shrinkage rate in the width direction = 0.01-100, inclusive. (Shrinkage rate = (dimensions before heating - dimensions after heating)/dimensions before heating ×100(%))