| 摘要 |
PROBLEM TO BE SOLVED: To provide a method, etc., for evaluating film stress, capable of correctly deriving conditions for forming a thin film having a small film stress.SOLUTION: A method for evaluating a film stress in a mask blank including a lower layer film and an upper layer film on a substrate comprises the steps of: preparing the substrate including the lower layer film and measuring the surface of the lower layer film to acquire the surface shape of the lower layer film; depositing the upper layer film in contact with the surface of lower layer film; measuring the surface of the upper layer film to acquire the surface shape of the upper layer film; and calculating a difference shape between the surface shape of the lower layer film and the surface shape of the upper layer film to evaluate the film stress of the upper layer film from the difference shape.SELECTED DRAWING: None |
