SEMICONDUCTOR DEVICE, AND MEASUREMENT METHOD FOR THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device having a testing pad that can reduce adhesion of pad pieces to a probe.SOLUTION: A semiconductor device 1 comprises: a semiconductor element 42 (a transistor) provided on a substrate 2; an insulating layer provided on the semiconductor element 42; and a pad electrode 10 provided on the insulating layer, and that consists of a first pad part 11a and a second pad part 11b connected with each other. The pad electrode 10 is electrically connected with the semiconductor element 42, and the second pad part 11b has a plurality of grooves on the surface thereof. The grooves are in contact with a probe on their surfaces, and continuously extend in a moving direction of the probe.SELECTED DRAWING: Figure 1