System architecture for vacuum processing

摘要

A system for processing substrates in plasma chambers, such that all substrates transport and loading/unloading operations are performed in atmospheric environment, but processing is performed in vacuum environment. The substrates are transported throughout the system on carriers. The system's chambers are arranged linearly, such that carriers move from one chamber directly to the next. A conveyor, placed above or below the system's chambers, returns the carriers to the system's entry area after processing is completed. Loading and unloading of substrates may be performed at one side of the system, or loading can be done at the entry side and unloading at the exit side.

主权项

1. A system for processing substrates in vacuum chamber, comprising:
a plurality of carriers, each carrier configured for supporting and transporting substrates throughout the system; a loading station for loading substrates onto the carriers; a carrier transport system for transporting the carriers throughout the system and returning the carriers to the loading station; a loadlock chamber arrangement for introducing carries into vacuum environment; at least one vacuum processing chamber receiving a plurality of carriers from the loadlock arrangement, the vacuum processing chamber sized and configured for simultaneously housing the plurality of carriers and simultaneously processing substrates positioned on the plurality of carriers; and, a buffer station positioned between the loading station and the loadlock arrangement, wherein the buffer station comprises carrier rotating arrangement for rotating the carriers from a horizontal orientation to a vertical orientation; wherein the carrier transport system comprises a conveyor for returning carriers to the loading station after completion of processing; and, wherein the conveyor passes above the processing chamber in atmospheric environment.