Integrated anode and activated reactive gas source for use in magnetron sputtering device

摘要

The invention relates to an integrated anode and activated reactive gas source for use in a magnetron sputtering device and a magnetron sputtering device incorporating the same. The integrated anode and activated reactive gas source comprises a vessel having an interior conductive surface, comprising the anode, and an insulated outer body isolated from the chamber walls of the coating chamber. The vessel has a single opening with a circumference smaller that that of the vessel in communication with the coating chamber. Sputtering gas and reactive gas are coupled through an input into the vessel and through the single opening into the coating chamber. A plasma is ignited by the high density of electrons coming from the cathode and returning to the power supply through the anode. A relatively low anode voltage is sufficient to maintain a plasma of activated reactive gas to form stoichiometric dielectric coatings.

主权项

1. A magnetron sputtering device comprising:
a coating chamber adapted to be evacuated in operation; a cathode having a central axis on which is disposed a target comprising material for forming a coating on one or more substrates; a carrier comprising a plurality of coating areas and disposed above the target; and one or more integrated anode and activated reactive gas sources located adjacent to the cathode, wherein each integrated anode and activated reactive gas source comprises:
a vessel including:a conductive interior surface having one or more sidewalls and an adjoining end wall defining an interior of the vessel, electrically coupled to a positive output of a power supply, thereby serving as an anode and a preferred return path for electrons,an insulated outer surface for electrically isolating the vessel from chamber walls of the coating chamber;an opening configured to permit gas to pass from the interior of the vessel to the coating chamber; andone or more gas inlet ports that are configured to direct a sputtering gas and a reactive gas to the interior of the vessel such that the reactive gas becomes activated forming a plasma in the interior of the vessel; wherein a center point of the carrier and the opening of the integrated anode and activated reactive gas sources are disposed a same radial distance from the central axis of the cathode.