| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve reliability of a semiconductor device and to reduce cost thereof. <P>SOLUTION: In this method of manufacturing the semiconductor device, in the semiconductor device 1 having a structure wherein a semiconductor chip 8 mounted on a principal surface of a package substrate 2 is sealed by a sealing member 11, conductor patterns 4 for wiring are arranged on the principal surface and the back surface of the package substrate 2, and a conductor pattern 4 for a dummy is arranged in a region where no conductor patterns 4 for wiring therein are arranged. By thus increasing the density of the conductor patterns 4 on the package substrate 2, warpage, undulation and the like of the package substrate 2 due to heat treatment during a manufacturing process of the semiconductor device 1 can be reduced. <P>COPYRIGHT: (C)2011,JPO&INPIT |
