METHOD FOR INSPECTING POSITIONING OF INSERT COMPONENT, METHOD FOR MOUNTING INSERT COMPONENT, DEVICE FOR INSPECTING POSITIONING OF INSERT COMPONENT, AND DEVICE FOR MOUNTING INSERT COMPONENT

摘要

When inspecting whether an insert component (41) provided with a protruding (42) part for positioning and an electrode part (45) for surface mounting can be mounted on a circuit substrate (43) provided with a land (46) for connecting the electrode part for surface mounting and with a positioning hole (44) into which the protruding part for positioning is inserted, images of the protruding part for positioning and the electrode part for surface mounting on the insert component are separately or simultaneously formed by a camera (16) for forming the image of a component, and the images thus formed are processed, whereby the position of the protruding part for positioning and the position of the electrode part for surface mounting are recognized. The positional offset between the electrode part for surface mounting on the insert component and the land of the circuit substrate is then calculated on the assumption that the protruding part for positioning on the insert component is inserted into the positioning hole of the circuit substrate, and it is inspected whether the insert component can be mounted on the circuit substrate by determining whether the positional offset is within an allowable range.