发明名称
摘要 Disclosed is a print technology in which a solder pool staying on the surface of a mask is driven by means of a squeegee, and solder is applied onto a substrate onto which the lower surface of a mask is placed. A forward print process where solder is applied by driving a squeegee in a predetermined forward direction relative to a mask, and a backward print process where the solder is applied by driving the squeegee in a returning direction opposite to the forward direction are switched alternately. When the squeegee passes through the solder pool on the downstream side in a moving direction before switching in the course of switching from any one of the forward and backward print processes to the other one of these processes, the amount of solder in the solder pool is measured. Based on the amount of solder thus measured, the necessity of replenishing solder is determined. The solder pool is supplemented with solder, based on the result of the decision on whether solder replenishment is required.
申请公布号 JP4643719(B2) 申请公布日期 2011.03.02
申请号 JP20090027310 申请日期 2009.02.09
申请人 发明人
分类号 B41F15/40;B41F15/08;B41F33/14;H05K3/34 主分类号 B41F15/40
代理机构 代理人
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