Copper-clad board, method of making hole in said copper-clad board and printing wiring board comprising said copper-clad board,申请号EP20000309749-传众专利搜索

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发明名称	Copper-clad board, method of making hole in said copper-clad board and printing wiring board comprising said copper-clad board
摘要
申请公布号	EP1097806(A3)	申请公布日期	2002.09.25
申请号	EP20000309749	申请日期	2000.11.03
申请人	MITSUBISHI GAS CHEMICAL COMPANY, INC.	发明人	GAKU, MORIO;IKEGUCHI, NOBUYUKI;KATO, YOSHIHIRO;YOSHIDA, TARO
分类号	H05K3/40;B32B15/08;H05K3/00;H05K3/02;H05K3/38;H05K3/42;(IPC1-7):B32B15/08;B23K26/18	主分类号	H05K3/40
代理机构		代理人
主权项
地址

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