| 摘要 |
PROBLEM TO BE SOLVED: To achieve a high productivity and suppress the occurrence of defects in manufacturing a flexible wiring board having a flying lead. SOLUTION: In a method of manufacturing the flexible wiring board having the flying lead section which consists of an insulation layer formed with an opening and a conductor circuit layer formed opposite to the opening, the insulation layer is etched in such a manner that a portion to correspond to the opening for land access may be left over by a prescribed thickness, and then the conductor circuit layer is patterned, and thereafter, the insulation layer remaining by the prescribed thickness in the opening is removed. The insulation layer is considered as, for example, a polyimide precursor, and is turned into an imido after being etched halfway. COPYRIGHT: (C)2005,JPO&NCIPI
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