| 摘要 |
PURPOSE: A substrate for manufacturing a semiconductor package and the semiconductor package using the same are provided to reduce the transmission path of an electrical signal by electrically connecting semiconductor chips to substrates through bumps. CONSTITUTION: A first substrate part(110) includes a first pad region(115), a second pad region(117), and a third pad region. A first connection pad(112) is located on the upper side of the first pad region. A second connection pad(114) is located on the lower side of the second pad region. A second substrate part(120) is located on the upper edge of the first substrate part. The second substrate part includes a fourth pad region in which fourth connection pads are arranged. |
