| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic device where the warp of a circuit substrate is reduced even after a mounting component is mounted on the circuit substrate and a method for manufacturing the same. <P>SOLUTION: The electronic device mounts the mounting component having a second electrode on the circuit substrate having a first electrode, wherein the circuit substrate 1 and the mounting component 3 are laminated and bonded through a flexible insulating member 6, and are electrically connected to the first and the second electrodes through a feed-through electrode 9 which passes through a wiring electrode formed on the surface of the flexible insulating member 6 or the flexible insulating member 6. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
